Maboto a Potoloho a Koporo e Matla a Hatisitsoeng
PCB ea koporo e boima ke eng?
Hangata liboto tse hatisitsoeng ka mahlakoreng a mabeli li entsoe ka lesela la koporo la khalase ea epoxy. E sebelisoa haholo-holo bakeng sa lisebelisoa tsa elektronike tsa puisano tse nang le litlhoko tse phahameng tsa tshebetso Thepa, lisebelisoa tse tsoetseng pele le lik'homphieutha tsa elektroniki, joalo-joalo.
Ts'ebetso ea tlhahiso ea mapolanka a mahlakoreng a mabeli ka kakaretso e arotsoe ka mekhoa e 'maloa, ho kenyelletsa mokhoa oa terata oa ts'ebetso, mokhoa oa ho thibela lesoba, mokhoa oa masking, le mokhoa oa graphic electroplating etching.
Sebopeho |
Tlhaloso ea tekheniki ea AREX |
Palo ea lihlopha |
4 - 22 layers standard, 30 layers e tsoetseng pele, 40 layers prototype, haholo ho latela botenya ba koporo. |
Lintlha-khōlō tsa theknoloji |
Mekhahlelo e mengata ea fiber ea khalase ea epoxy e kopantsoeng hammoho le likarolo tse ngata tsa koporo ea botenya bo fapaneng. |
Lisebelisoa |
Tshebetso e phahameng FR4, halogen-free FR4 |
Boima ba koporo (bo felile) |
18-210µm, e tsoetseng pele 1050µm / 30 Oz |
Bonyane pina le lekhalo |
0,075mm / 0,075mm (haholo ho latela botenya ba koporo) |
Botenya ba PCB |
0.40mm - 7.0mm, Min botenya ho itšetlehile ka palo ea lihlopha le botenya ba koporo |
Boholo ba litekanyo |
580mm x 1080mm, e tsoetseng pele 610mm x 1400mm |
Lisebelisoa tsa sefahleho li fumaneha |
HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers (HASL / LF HASL ha e khothalletsoe) |
Bonyane boro ea mochini |
0.20 limilimithara |